In-contact Continuous Temperature Measurement Probe for Non-insulated Electric-Current Carrying Conductor

ABSTRACT

An in-contact temperature measurement probe, which can measure temperature accurately on the surface of a current carrying wire, rod, heater, or other device, while maintaining the safety of the user via employing non-electrically conductive but thermally conductive materials.

BACKGROUND 1) Field of the Disclosure

The present disclosure provides an in-contact temperature measurementprobe which can measure temperature accurately on the surface of acurrent carrying wire, rod, heater, or other device.

2) Description of Related Art

Currently, there are no probes that can measure in-contact temperatureof the current flowing in a conductive pipe/rod without any insulation.Current practice involves thermocouples in a metallic casing (which iselectrically conductive) be used for temperature measurement inside awire carrying electric current. Ceramic disks with thermocouple endsproduced by Stern Lab may be used but are extremely expensive (e.g.,$5,000 for a single probe). Infrared imaging and thermal guns arecurrently used as non-contact probes, such as those manufactured byFluke, Etekcity, which range in cost from $25-$20,000. Further, accuracyof IR probes depends on calibration and is significantly affected bysurface emissivity.

For electrical current carrying wires, tubes, heaters, etc., it isdesirable, and often necessary, to know the temperature of the conductoritself especially where temperature is a crucial component in the study.Attempts have been made to measure the surface temperature of electricalconductors by either using a thermocouple with metallic casing or byusing a ceramic disc as a contact material in-between a thermocoupleprobe and the target objects. In the former case, there are highoperational risks; in the latter case the price of the thermocouple isexorbitantly expensive. Accordingly, the present disclosure provides athermal probe that mitigates personnel risk and reduces costconsiderably.

Citation or identification of any document in this application is not anadmission that such a document is available as prior art to the presentdisclosure.

SUMMARY

The above objectives are accomplished according to the presentdisclosure by providing an in-contact temperature probe. The probe mayinclude at least one thermocouple, wherein the at least one thermocouplemay be embedded in a non-electrically conducive rod, which may compriseat least one thermally conductive adhesive and the probe may be shapedto conform to a measuring surface shape when placed in contact with themeasuring surface. Further, the measuring surface the in-contacttemperature probe contacts may include a current carrying wire, rod, orheater. Further, the probe may be designed to withstand temperatures upto 200 degrees Celsius. Still, the rod may include multiplethermocouples with a number of the multiple thermocouples proportionalto a length of the rod. Moreover, the probe may detect temperature, heattransfer data, and/or location of weak points in current carrying lines.Further again, the rod may completely enclose an inner space. Yet, therod may partially enclose an inner space. Still further, the probe maymeasure temperature over a predefined length of a measured surface asopposed to a single point on the measured surface. Still yet, the probemay include a shaped thermocouple array. Further again, at least onethermocouple may extend beyond an outer surface of the rod.

In a further embodiment, a method is provided for forming an in-contacttemperature probe. The method may include selecting a shape for thein-contact temperature probe that conforms to a shape of a measuredsurface, forming a mold that conforms to the selected shape of thein-contact temperature probe, inserting a molding tube into the mold,drilling at least one hole in a surface of the molding tube, placing atleast one thermocouple inside the molding tube, injecting thermallyconductive adhesive into the molding tube to form an in-contacttemperature probe structure, and curing the in-contact temperature probestructure. Further, the method may include injecting the thermallyconductive adhesive such that no air gaps form in the in-contacttemperature probe structure. Still yet, the at least one thermocoupleand the thermally conductive adhesive may be selected to withstandtemperatures up to 200 degrees Celsius. Moreover, multiple holes may bedefined in the molding tube. Yet again, the in-contact temperature probemay be shaped to completely enclose an inner space. Further again, thein-contact temperature probe may be shaped to partially enclose an innerspace. Still yet, the in-contact temperature probe may be shaped tomeasure temperature over a predefined length of the measured surface asopposed to a single point on the measured surface. Still further, ashaped thermocouple array may be formed.

Citation or identification of any document in this application is not anadmission that such a document is available as prior art to the presentdisclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The construction designed to carry out the disclosure will hereinafterbe described, together with other features thereof. The disclosure willbe more readily understood from a reading of the following specificationand by reference to the accompanying drawings forming a part thereof,wherein an example of the disclosure is shown and wherein:

FIG. 1 shows a hollow tube that may be used to form probes of thecurrent disclosure.

FIG. 2 shows an assembled tube structure of the current disclosureplaced in a laboratory oven.

FIG. 3 shows a completed probe of the current disclosure.

FIG. 4 shows an alternate embodiment of a completed probe of the currentdisclosure.

FIG. 5 shows transverse and cross-sectional views of probes of thecurrent disclosure.

FIG. 6A shows solid state probe embodiments of the current disclosure.

FIG. 6B shows that multiple thermocouple wires and multiple thermocoupletips may be placed within probes of the current disclosure.

FIG. 7 shows hollow-structure embodiments of probes of the currentdisclosure.

FIG. 8 shows a thermocouple array of the current disclosure.

FIG. 9 : Temperature Calibration for the multi-thermocouple probe in hotoil bath at 120° C.

FIG. 10 : Temperature Calibration for the multi-thermocouple probe inhot oil bath at 150° C.

FIG. 11 : Temperature Calibration for the multi-thermocouple probe inhot oil bath at 170° C.

FIG. 12 : Temperature Calibration for the multi-thermocouple probe inhot oil bath at 188° C.

FIG. 13 : Average deviation of the temperature probe temperaturereadings with respect to the free thermocouples

FIG. 14 : Maximum deviation of the temperature probe temperaturereadings with respect to the free thermocouples

FIG. 15 : Minimum deviation of the temperature probe temperaturereadings with respect to the free thermocouples

FIG. 16 : Temperature Calibration for the single-thermocouple probe inhot oil bath at 30° C.

FIG. 17 : Temperature Calibration for the two single-thermocouple probein hot oil bath at 80° C.

FIG. 18 : Temperature Calibration for the two single-thermocouple probein hot oil bath at 130° C.

FIG. 19 : Temperature Calibration for the two single-thermocouple probein hot oil bath at 180° C.

FIG. 20 shows an oil bath set-up of the current disclosure.

It will be understood by those skilled in the art that one or moreaspects of this disclosure can meet certain objectives, while one ormore other aspects can meet certain other objectives. Each objective maynot apply equally, in all its respects, to every aspect of thisdisclosure. As such, the preceding objects can be viewed in thealternative with respect to any one aspect of this disclosure. These andother objects and features of the disclosure will become more fullyapparent when the following detailed description is read in conjunctionwith the accompanying figures and examples. However, it is to beunderstood that both the foregoing summary of the disclosure and thefollowing detailed description are of a preferred embodiment and notrestrictive of the disclosure or other alternate embodiments of thedisclosure. In particular, while the disclosure is described herein withreference to a number of specific embodiments, it will be appreciatedthat the description is illustrative of the disclosure and is notconstructed as limiting of the disclosure. Various modifications andapplications may occur to those who are skilled in the art, withoutdeparting from the spirit and the scope of the disclosure, as describedby the appended claims. Likewise, other objects, features, benefits andadvantages of the present disclosure will be apparent from this summaryand certain embodiments described below, and will be readily apparent tothose skilled in the art. Such objects, features, benefits andadvantages will be apparent from the above in conjunction with theaccompanying examples, data, figures and all reasonable inferences to bedrawn therefrom, alone or with consideration of the referencesincorporated herein.

The figures herein are for illustrative purposes only and are notnecessarily drawn to scale.

DETAILED DESCRIPTION OF A PREFERRED EMBODIMENT

With reference to the drawings, the disclosure will now be described inmore detail. Unless defined otherwise, all technical and scientificterms used herein have the same meaning as commonly understood to one ofordinary skill in the art to which the presently disclosed subjectmatter belongs. Although any methods, devices, and materials similar orequivalent to those described herein can be used in the practice ortesting of the presently disclosed subject matter, representativemethods, devices, and materials are herein described.

Unless specifically stated, terms and phrases used in this document, andvariations thereof, unless otherwise expressly stated, should beconstrued as open ended as opposed to limiting Likewise, a group ofitems linked with the conjunction “and” should not be read as requiringthat each and every one of those items be present in the grouping, butrather should be read as “and/or” unless expressly stated otherwise.Similarly, a group of items linked with the conjunction “or” should notbe read as requiring mutual exclusivity among that group, but rathershould also be read as “and/or” unless expressly stated otherwise.

Furthermore, although items, elements or components of the disclosuremay be described or claimed in the singular, the plural is contemplatedto be within the scope thereof unless limitation to the singular isexplicitly stated. The presence of broadening words and phrases such as“one or more,” “at least,” “but not limited to” or other like phrases insome instances shall not be read to mean that the narrower case isintended or required in instances where such broadening phrases may beabsent.

All publications and patents cited in this specification are cited todisclose and describe the methods and/or materials in connection withwhich the publications are cited. All such publications and patents areherein incorporated by references as if each individual publication orpatent were specifically and individually indicated to be incorporatedby reference. Such incorporation by reference is expressly limited tothe methods and/or materials described in the cited publications andpatents and does not extend to any lexicographical definitions from thecited publications and patents. Any lexicographical definition in thepublications and patents cited that is not also expressly repeated inthe instant application should not be treated as such and should not beread as defining any terms appearing in the accompanying claims. Thecitation of any publication is for its disclosure prior to the filingdate and should not be construed as an admission that the presentdisclosure is not entitled to antedate such publication by virtue ofprior disclosure. Further, the dates of publication provided could bedifferent from the actual publication dates that may need to beindependently confirmed.

As will be apparent to those of skill in the art upon reading thisdisclosure, each of the individual embodiments described and illustratedherein has discrete components and features which may be readilyseparated from or combined with the features of any of the other severalembodiments without departing from the scope or spirit of the presentdisclosure. Any recited method can be carried out in the order of eventsrecited or in any other order that is logically possible.

Where a range is expressed, a further embodiment includes from the oneparticular value and/or to the other particular value. The recitation ofnumerical ranges by endpoints includes all numbers and fractionssubsumed within the respective ranges, as well as the recited endpoints.Where a range of values is provided, it is understood that eachintervening value, to the tenth of the unit of the lower limit unlessthe context clearly dictates otherwise, between the upper and lowerlimit of that range and any other stated or intervening value in thatstated range, is encompassed within the disclosure. The upper and lowerlimits of these smaller ranges may independently be included in thesmaller ranges and are also encompassed within the disclosure, subjectto any specifically excluded limit in the stated range. Where the statedrange includes one or both of the limits, ranges excluding either orboth of those included limits are also included in the disclosure. Forexample, where the stated range includes one or both of the limits,ranges excluding either or both of those included limits are alsoincluded in the disclosure, e.g. the phrase “x to y” includes the rangefrom ‘x’ to ‘y’ as well as the range greater than ‘x’ and less than ‘y’.The range can also be expressed as an upper limit, e.g. ‘about x, y, z,or less’ and should be interpreted to include the specific ranges of‘about x’, ‘about y’, and ‘about z’ as well as the ranges of ‘less thanx’, less than y’, and ‘less than z’. Likewise, the phrase ‘about x, y,z, or greater’ should be interpreted to include the specific ranges of‘about x’, ‘about y’, and ‘about z’ as well as the ranges of ‘greaterthan x’, greater than y’, and ‘greater than z’. In addition, the phrase“about ‘x’ to ‘y’”, where ‘x’ and ‘y’ are numerical values, includes“about ‘x’ to about ‘y’”.

It should be noted that ratios, concentrations, amounts, and othernumerical data can be expressed herein in a range format. It will befurther understood that the endpoints of each of the ranges aresignificant both in relation to the other endpoint, and independently ofthe other endpoint. It is also understood that there are a number ofvalues disclosed herein, and that each value is also herein disclosed as“about” that particular value in addition to the value itself. Forexample, if the value “10” is disclosed, then “about 10” is alsodisclosed. Ranges can be expressed herein as from “about” one particularvalue, and/or to “about” another particular value. Similarly, whenvalues are expressed as approximations, by use of the antecedent“about,” it will be understood that the particular value forms a furtheraspect. For example, if the value “about 10” is disclosed, then “10” isalso disclosed.

It is to be understood that such a range format is used for convenienceand brevity, and thus, should be interpreted in a flexible manner toinclude not only the numerical values explicitly recited as the limitsof the range, but also to include all the individual numerical values orsub-ranges encompassed within that range as if each numerical value andsub-range is explicitly recited. To illustrate, a numerical range of“about 0.1% to 5%” should be interpreted to include not only theexplicitly recited values of about 0.1% to about 5%, but also includeindividual values (e.g., about 1%, about 2%, about 3%, and about 4%) andthe sub-ranges (e.g., about 0.5% to about 1.1%; about 5% to about 2.4%;about 0.5% to about 3.2%, and about 0.5% to about 4.4%, and otherpossible sub-ranges) within the indicated range.

Unless defined otherwise, technical and scientific terms used hereinhave the same meaning as commonly understood by one of ordinary skill inthe art to which this disclosure pertains. Definitions of common termsand techniques in molecular biology may be found in Molecular Cloning: ALaboratory Manual, 2nd edition (1989) (Sambrook, Fritsch, and Maniatis);Molecular Cloning: A Laboratory Manual, 4th edition (2012) (Green andSambrook); Current Protocols in Molecular Biology (1987) (F. M. Ausubelet al. eds.); the series Methods in Enzymology (Academic Press, Inc.):PCR 2: A Practical Approach (1995) (M. J. MacPherson, B. D. Hames, andG. R. Taylor eds.): Antibodies, A Laboratory Manual (1988) (Harlow andLane, eds.): Antibodies A Laboraotry Manual, 2nd edition 2013 (E. A.Greenfield ed.); Animal Cell Culture (1987) (R. I. Freshney, ed.);Benjamin Lewin, Genes IX, published by Jones and Bartlet, 2008 (ISBN0763752223); Kendrew et al. (eds.), The Encyclopedia of MolecularBiology, published by Blackwell Science Ltd., 1994 (ISBN 0632021829);Robert A. Meyers (ed.), Molecular Biology and Biotechnology: aComprehensive Desk Reference, published by VCH Publishers, Inc., 1995(ISBN 9780471185710); Singleton et al., Dictionary of Microbiology andMolecular Biology 2nd ed., J. Wiley & Sons (New York, N.Y. 1994), March,Advanced Organic Chemistry Reactions, Mechanisms and Structure 4th ed.,John Wiley & Sons (New York, N.Y. 1992); and Marten H. Hofker and Janvan Deursen, Transgenic Mouse Methods and Protocols, 2nd edition (2011).

As used herein, the singular forms “a”, “an”, and “the” include bothsingular and plural referents unless the context clearly dictatesotherwise.

As used herein, “about,” “approximately,” “substantially,” and the like,when used in connection with a measurable variable such as a parameter,an amount, a temporal duration, and the like, are meant to encompassvariations of and from the specified value including those withinexperimental error (which can be determined by e.g. given data set, artaccepted standard, and/or with e.g. a given confidence interval (e.g.90%, 95%, or more confidence interval from the mean), such as variationsof +/−10% or less, +/−5% or less, +/−1% or less, and +/−0.1% or less ofand from the specified value, insofar such variations are appropriate toperform in the disclosure. As used herein, the terms “about,”“approximate,” “at or about,” and “substantially” can mean that theamount or value in question can be the exact value or a value thatprovides equivalent results or effects as recited in the claims ortaught herein. That is, it is understood that amounts, sizes,formulations, parameters, and other quantities and characteristics arenot and need not be exact, but may be approximate and/or larger orsmaller, as desired, reflecting tolerances, conversion factors, roundingoff, measurement error and the like, and other factors known to those ofskill in the art such that equivalent results or effects are obtained.In some circumstances, the value that provides equivalent results oreffects cannot be reasonably determined. In general, an amount, size,formulation, parameter or other quantity or characteristic is “about,”“approximate,” or “at or about” whether or not expressly stated to besuch. It is understood that where “about,” “approximate,” or “at orabout” is used before a quantitative value, the parameter also includesthe specific quantitative value itself, unless specifically statedotherwise.

For the present disclosure, single/multiple thermocouple(s) may beembedded in the interior of a manufactured adhesive rod, which permitsaccurate measurement of the temperature, heat transfer data, andlocation of weak points in the current carrying lines. A thermocouple isan electrical device consisting of two dissimilar electrical conductorsforming an electrical junction. A thermocouple produces atemperature-dependent voltage as a result of the thermoelectric effect,and this voltage can be interpreted to measure temperature.Thermocouples are a widely used type of temperature sensor. Possiblematerials for the thermocouple wiring include, but are not limited tonickel alloys such as chromel-constantan, iron-constantan,chromel-alumel, nicrosil-Nisil, copper-constantan, platinum alloys,platinum/rhodium alloys, tungsten/rhenium alloys, gold alloys, ironalloys, iridium allows, HTIR-TC (High Temperature Irradiation Resistant)thermocouples, etc. The wiring may be insulated with mica-glass tap,TFE-tape, TFE-glass tape, vitreous silica, glass braid, Skive TFE tape,ceramic fibers, polyvinyls, nylon, PVC, FEP, Kapton, Tefzel, PFA, T300,etc.

The disclosure provides an in-contact temperature measurement probe,which can measure temperature accurately and directly on the surface ofa current carrying wire, rod, heater, or other device. The wire, rod,heater or other device may be a non-insulated electric-current carryingconductor The probe's size, shape, and other physical features depend onthe object of interest and can be made according to the user'srequirement. The probe is made from a higher thermal conductivityadhesive available in the market and the thermocouples are installed atspecified locations on the probe. The detailed procedure for thecreation of the thermocouple probe is described below. (1) The shape formolding the thermocouple probe is decided and finalized, for purposes ofexample only and not intended to be limiting, a circular thermocoupleprobe. (2) The mold for the thermocouple is created by using an aluminumrod with a groove that can fit a polytetrafluoroethylene (PTFE) (e.g.,Teflon®) molding tube of the specified diameter. The molding tube may besolid or hollow in form, such as a solid rod or a hollow column of PTFEor a similar material. PTFE has one of the lowest coefficients offriction known, is hydrophobic, meaning neither water norwater-containing substances wet PTFE, is almost totally chemically inertand highly insoluble in most solvents or chemicals, has a largeoperating temperature range, proving thermally stable enough to be usedbetween −328° F. and +500° F. without degrading, as well as has highflexural strength, even at low temperatures. Further PTFE has highelectrical resistance and dielectric strength, especially at high radiofrequencies. Other suitable materials include Other suitable materialsmay include, but are not limited to PTFE, FEP, PEEK, PFA, ETFE, PVDF,LCP, PCTFE, and/or PFA. These materials are chosen to withstandtemperatures up to 200 degrees C.

(3) Several holes are drilled on one side of the Teflon tube for theinjection of thermal adhesive. Thermal adhesive is a type of thermallyconductive glue used for electronic components and heat sinks. It can beavailable as a paste (similar to thermal paste) or as a double-sidedtape. It is commonly used to bond integrated circuits to heatsinks wherethere are no other mounting mechanisms available. The glue may be atwo-part epoxy resin (usually for paste products) or cyanoacrylate (fortapes). The thermally conductive material can vary including metals,metal oxides, silica or ceramic microspheres. The latter are found inproducts that have much higher dielectric strength, although this comesat the cost of lower thermal conductivity. Possible examples of thermaladhesive include, but are not limited to, epoxy resins, such asElecolit® 6207, Elecolit® 6601, Elecolit® 6603, Elecolit® 6604,Elecolit® 6616, Vitralit® 6129 all available from Panacol-USA, Inc.,Torrington, CT, silicone alone or with thermally conductive materialsembedded, such as aluminum nitride, boron nitride, alumina, or beryllia,various polyurethanes, etc.

The number of holes to be drilled on the Teflon tube is directlyproportional to the length of the Teflon tube. The lengths of the freethermocouples are measured and are inserted into the Teflon tube. (4)The thermal adhesive is prepared for injection using the hot bath and itis then transferred into a syringe. The highly viscous thermal adhesiveis then injected into the Teflon tube making sure that there are no airgaps. (5) The assembled thermocouple probe and the thermocouples arecured at the specified temperature in a regular laboratory oven.

The shape of the probe is decided by the user and the cast for makingthe probe is manufactured using any non-stick material such aspolytetrafluoroethylene (PTFE), one non-limiting example being Teflon,or other materials such as a three-layer coating using PTFE and PFA, onenon-limiting example being Silverstone. The thermal adhesive is madeinto a paste as per the instructions provided by MSDS (Material SafetyData Sheet). The MSDS specifies the thermal adhesive properties such asmaterial composition, curing cycle, temperature profile, etc. It alsospecifies the safety precautions to be taken while handling thematerial.

The length of each thermocouple to be inserted into the probe ismeasured using a ruler and marked using a permanent marker and insertedinto the hollow tube/rod 100, which may be made of Teflon or anothernonstick substance, see FIG. 1 . A syringe, not shown, is then used toinsert thermal adhesive 101 into tube 100 and complete filling isensured by holes 102 defined within outer surface 104 of tube 100 toform an assembled tube structure 106. This allows uniform injection ofthe thermal adhesive without creation of air pockets within the tube.Assembled tube structure 106 is then placed in a regular laboratory oven200, see FIG. 2 , at 121° C. for 8 hours for the proper curing. Once theadhesive is cured, the outer Teflon casing is removed, and one mayobtain the temperature probe ready for measurements.

The location of the holes in the tube is determined by the length of thetube. Placement of the thermocouples within the tube may be determinedvis-à-vis the detection range of the thermocouples employed in theprobe. For example, if the tube is twelve inches long and thethermocouples have a range of approximately one and one-half inches,then three holes may be drilled with three inch spacing on each side ofthe three holes to ensure the probes can measure temperature over a spanof the tube. Further, thermocouples may be placed to ensure coveragealong the entirety of the tube or only along portions of the tube. Suchas, for purposes of example only and not intended to be limiting,thermocouples placed evenly along the tube length to report temperaturealong the tube's entire length from end-to-end. However, thermocouplesmay also be placed to only measure precise locations along the tube inorder to avoid picking up heat/signatures/data from nearby elements thatare not desired to be included in the measurement. This may includespacing thermocouples to only take temperature or other readings alongthe last four inches of the tube, or to take measurements at intervalsalong the tube length, such as at 2 to 4 inches, 6 to 8 inches, and 10to 12 inches without measuring the temperature at the intervals between.While precise measurements have been discusses above, these are forpurposes of example only and not intended to be limited with respect tothermocouples placement as various, even random, placement locations areconsidered within the scope of this disclosure.

FIG. 3 shows a completed probe 300 and FIG. 4 shows an alternateembodiment of a completed probe 400 which may be produced pursuant tothe current disclosure.

In a further embodiment, see FIG. 5 , which shows transverse andcross-sectional views of probes of the current disclosure may be formedin a hollow tube shape 500, or a semi-circular shape or C-shape 502, toallow for completely or partially enclosing objects to be measured.Thus, tube shape 500 may completely surround/enclose and internal space.Indeed, thermocouple probe placement may be varied along probe surface504 with multiple probe points 506 placed along probe surface 504. Tubeshape 500 may be employed for measuring, for purpose of example only andnot intended to be limited, a large diameter pipe. Meanwhile,semi-circular shape 502 may be employed for measuring, for purposes ofexample only and not intended to be limiting, small diameter objectssuch as conductive wires like copper.

FIG. 6A shows yet other possible embodiments of the current disclosuresuch as a solid-state probe 600, wherein probe body 601 is asubstantially filled solid and thermocouple tip 603 and thermocouplewire 605 are contained within the material 607 forming probe body 601,that may be formed in myriad shapes such as circular 602, square 604,rectangular 606, and triangular 608. Other shapes, such as polyhedron,dome, star, etc., are considered within the scope of the disclosure andit should not be limited to just the provided examples, which are forinformative purposes.

FIG. 6B shows that multiple thermocouple wires 605 and multiplethermocouple tips 603 may be placed within probe body 601. While 6Bshows a linear “single file line” placement, placement can be variedwithin probe body 601 as shown by circular probe 602, the resultingpatterns may be regular, such as evenly spaced around a central core offorming uniform distances among tips 603 or irregular placement, asdetermined by the need and style of measurement. The multi-thermocoupleprobe is used in various applications ranging from nuclear reactorstudies to temperature distribution over a microchannel to heat mapsover solid bodies in wind tunnels. These multi-point thermocouple probescould be used by electricians and electrical personnel to ensure safetywhile dealing with live wires. A single point probe can measure only atemperature at a specified point, for example, temperature on a hotplate, inlet and outlet temperatures, etc. whereas the multi-pointthermocouple probe can measure over a predefined length or the area of asurface. The locations of the thermocouples in the multi-pointthermocouple probe is determined by the researcher or the electricianbased on the study of temperature at particular regions or zones ofinterest. Since this thermocouple probe is customizable for specificpurposes, the design can be optimized based on necessity.

FIG. 7 shows further alternative embodiments. Thermocouple probe 700 maybe formed as a hollow structure 702 wherein an outer shell 704 defines asubstantially empty or completely empty interior 706. Thermocouple tips708 and thermocouple wires 710 may be placed within shell formingmaterial 712 of outer shell 704. As discussed herein, tips 708 and wires710 may be placed in various locations within outer shell 704 and mayeven extend through inner surface 714, or be flush therewith, of outershell 704. FIG. 7 further shows that the probes may be circular 716,square 718, rectangular 720, and/or triangular 722. Other shapes, suchas polyhedron, dome, star, etc., are considered within the scope of thedisclosure and it should not be limited to just the provided examples,which are for informative purposes.

FIG. 8 shows a thermocouple array 800. For instance, array 800 may becircular, such as coin shaped, such as 2″×2″, 4″×4″, 6″×6″, etc. Thesearrays could be places on straight or curved surfaces to conductreadings. Further, this configuration would provide an excellent thermalmap of an electrical conductor surface. By using these customizedthermocouple arrays, the temperatures at various points across astraight, curved or angled cross-section could be measured without anydifficulty. For example, in case of a curved pipe carrying hot fluids,the thermocouple array can be installed along the curvature of the pipesproviding an edge over the existing thermocouples in the market. Thus,the temperature over a curved surface could be measured by an in-contacttemperature measurement probe by virtue of ease of installation.

In a further embodiment, the thermal adhesive has higher thermalconductivity and electrical impedance and can be the best temperaturemeasurement device for the safe measurement of temperature in a currentcarrying conductor. The physical dimensions of the probe areuser-specific; hence it is one advantage of the current disclosure thatprobes derived therefrom may be molded into any shape. A probe of thecurrent disclosure will enable an accurate in-contact temperaturemeasurement of the electrical conductor. The temperature probe wouldalso act as a Non-Destructive Testing tool in determining the hot spots(weaker surfaces with higher temperatures) in the electrical conductors.

The temperature probe of the current disclosure is thermally conductiveand an excellent electrical insulator; hence, it can be used as anin-contact temperature measurement device for current carrying lines.This probe can be used to continuous measurement of the high resistiveheater generally used in industry or in high-end research. It can alsobe used as a non-destructive testing tool to measure temperature inwires/boilers to detect hot spots and help in fixing the issue beforeany breakdown occurs. With this disclosure, in the near future,household wiring temperature measurements would be made possible.

The current disclosure solves the problem of the unavailability ofprobes for temperature measurement in an electrical current carryingconductor. This is a far safer measurement tool (since the material isan electrical insulator) and very affordable ($100-$500) compared withother kinds of tools found in the current market. This disclosure wouldminimize the risk of the personnel working in the high-power densityenvironment providing a safer temperature measurement tool. Since theprobe is capable of continuous temperature measurements in any shape andsize and thermal conductivity of the material is reasonably high, theaccuracy of probes of the current disclosure is within ±0.6° C. Themanufactured single and multi-point thermocouple probes were inserted ina water bath and oil bath and temperatures were measured between 30° C.and 190° C. The deviation between the manufactured probe and the freethermocouple was found to be between 0% to 2.5%. Hence, the manufacturedthermocouple probes have very high accuracy of temperature measurement.

The temperature measurement probes made of thermal adhesives are placedinside an Inconel rod to simulate the actual test conditions forsimulated nuclear fuel rod experiment. Two mediums of study are chosenfor the test viz. water bath and oil bath. The Inconel rod with theprobe is then placed in an oil bath and the temperature range from 30°C. to 188° C. in the safe operating range. The Inconel rod is thenplaced in a water bath and the temperature range from 30° C. to 98° C.(boiling condition). FIGS. 9 through 19 provide the experimentalvalidation of the single and the multi-point thermocouple probes. Theoil bath setup is shown in FIG. 20 .

The single thermocouple and multi-thermocouple probe are connected tothe NI 9211 DAQ and LAB VIEW is used for data collection. A freethermocouple is also used for the comparison of the data obtained fromthe single and multi-thermocouple probes. The data is collected over250-450 seconds time interval.

The manufacturing process of the current disclosure is extremelystraightforward and does not require any advanced tooling skills and canbe fabricated in a laboratory setup in schools and universities to massmanufacturing plants. This is a niche product that can be used forvarious applications and has a potential household use, hence this wouldbe the first in the market and one-of-its-kind temperature measurementprobe that can be used by students, electricians, thermal engineers,etc.

While the present subject matter has been described in detail withrespect to specific exemplary embodiments and methods thereof, it willbe appreciated that those skilled in the art, upon attaining anunderstanding of the foregoing may readily produce alterations to,variations of, and equivalents to such embodiments. Accordingly, thescope of the present disclosure is by way of example rather than by wayof limitation, and the subject disclosure does not preclude inclusion ofsuch modifications, variations and/or additions to the present subjectmatter as would be readily apparent to one of ordinary skill in the artusing the teachings disclosed herein.

What is claimed is:
 1. A method for forming an in-contact temperatureprobe comprising: selecting a shape for the in-contact temperature probethat conforms to a shape of a measured surface; forming a mold thatconforms to the selected shape of the in-contact temperature probe;inserting a molding tube into the mold; drilling at least one hole in asurface of the molding tube; placing at least one thermocouple insidethe molding tube; injecting thermally conductive adhesive into themolding tube to form an in-contact temperature probe structure; andcuring the in-contact temperature probe structure.
 2. The method ofclaim 1 further comprising, injecting the thermally conductive adhesivesuch that no air gaps form in the in-contact temperature probestructure.
 3. The method of claim 1 further comprising, selecting the atleast one thermocouple and the thermally conductive adhesive towithstand temperatures up to 200 degrees Celsius.
 4. The method of claim1 further comprising, defining multiple holes in the molding tube. 5.The method of claim 1 further comprising, shaping the in-contacttemperature probe to completely enclose an inner space.
 6. The method ofclaim 1 further comprising, shaping the in-contact temperature probe topartially enclose an inner space.
 7. The method of claim 1 furthercomprising, shaping the in-contact temperature probe to measuretemperature over a predefined length of the measured surface as opposedto a single point on the measured surface.
 8. The method of claim 1further comprising, forming a shaped thermocouple array in the moldingtube.